Perfect effect for soldering.

No corrosive to IC and PCB. 

Its boiling point is a little high than melting point of tin, which helps to control the temperature of IC and PCB as solder paste evaporation as soon as tin melting.It’s more like boiling water in pot.The pot couldn’t be demaged by the high temperature as long as still having water in it.

BEST-223-UV made from the mixture of aluminium alloy solder powder and rosin solder flux is  a special gel additive mixture according to ANSI-stb-004-006 standard.

It is used for reworking PCB,BGA,PGA and any other SMD.It based on the low ion activator system provides perfect efficiency of wetting tin,less somke and high insulation resistance of odd parts after soldering.